| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve accuracy and to stabilize characteristics by preventing shock or stresses from being added to a substrate, etc., inside of a resistor from a plate-like lead adheringly fixed to an insulated substrate in a surface mounted metal foil resistor obtained by forming a resistor pattern at a metal foil resistor which adhered to one side face of the insulated substrate and is resin-encapsulated. SOLUTION: This resistor is provided with plural plate-like leads 20 adhered to the other side face of a substrate and projecting outward from the side edge of the substrate, a bonding wire connecting a resistor pattern to the leads 20 and encapsulating resin for sealing the substrate and the bonding wire. Each of the plate-like leads is provided with a small hole near a position crossing a boundary with the outer peripheral surface of the sealing resin, and the leads 20 are folded at the positions of these small holes. The small hole formed at each lead 20 is desirably a long hole 26, which is long in the longitudinal direction of the lead 20.</p> |
