发明名称 HEAT GENERATING PART MOUNTING CASE AND HEAT SINK MECHANISM FOR HEAT GENERATING PART
摘要 PROBLEM TO BE SOLVED: To suppress a heat conduction to the periphery in simple configuration and to provide a high heat dissipating effect in respect to heat generating parts or peripheral parts thereof. SOLUTION: In a self-running power feeding device 16, grooves 1611 are formed on the surface of a casing 161 opposite to the mounting surface of a heating element 162 to gain a heat dissipating surface area. Space for the heating element 162 and the other peripheral circuit is secured for this increase in the radiation surface area, and the heat conduction to the other peripheral circuit is suppressed as well. Besides, the grooves 1611 formed on the casing 161 accelerate a wind flow.
申请公布号 JP2002016435(A) 申请公布日期 2002.01.18
申请号 JP20000200129 申请日期 2000.06.30
申请人 TOSHIBA CORP 发明人 INAGAKI SATOSHI;ITO TOSHIHIKO
分类号 H05K7/20;H01Q1/00;H01Q3/02;H01Q15/08;H01Q23/00;(IPC1-7):H01Q23/00 主分类号 H05K7/20
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