发明名称 |
Method and apparatus for illuminating projecting features on the surface of a semiconductor wafer |
摘要 |
Plural light sources are provided for directing ring patterns of light toward at least one reflective bump formed on and projecting from a first wafer surface of a semiconductor wafer. The intensity of light from the light sources may be varied and may be varied independently of one another.
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申请公布号 |
US2002093812(A1) |
申请公布日期 |
2002.07.18 |
申请号 |
US20010759792 |
申请日期 |
2001.01.12 |
申请人 |
ELECTROGLAS, INC. |
发明人 |
KIEST CARY S.;LENZKE WILLIAM F. |
分类号 |
H01L21/00;H01L23/485;(IPC1-7):A61G13/00;G06K9/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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