| 摘要 |
<P>PROBLEM TO BE SOLVED: To realize a surface mounted LED in which heat dissipation efficiency is enhanced and emission efficiency is enhanced by a reflective structure, and to realize a light emitting device employing it. <P>SOLUTION: The surface mounted LED comprises a substantially parallelepiped base mount 21 having thermal conductivity, an insulating wiring board 22 provided with conductive patterns 23 and 24 and being bonded to the base mount 21, an LED chip 25 being mounted in the mounting area 21b of the base mount 21 exposed through a mounting hole in the wiring board 22, and a thermally conductive reflective frame 26 being bonded to the base mount 21 and thermally coupled therewith while surrounding the LED chip 25. Heat generated from the LED chip 25 is dissipated by both or one of the base mount 21 and the reflective frame 26. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
