| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reduce the energy loss caused by a shield on the substrate surface or surface-processed scars, etc. in an internal process for causing internal cracks by a laser process. <P>SOLUTION: A laser beam L is divided into at least four beams Le and they are separately concentrated in the interior of a silicon substrate 10 to cause internal cracks 12. The substrate surface 11 has surface-processed scars 11a of linear processed portions by marking off. The incidence position of each beam Le on the substrate surface 11 is located at both sides of the surface-processed scar 11a to prevent the beam Le from being shaded by the surface-processed scar 11a, thus avoiding the energy loss. In a process of dividing the silicon substrate 10 into element chips by an external force, the stress is concentrated on the surface-processed scar 11a to join the scar 11a with the internal crack 12c so that the substrate surface 11 is reliably divided along an expected dividing line C, thus precisely dividing it. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
