| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a non-contact data carrier manufacturable at a cost lower than before and a method of manufacturing the data carrier. <P>SOLUTION: This non-contact data carrier includes a semiconductor element sealed with resin, and an antenna circuit. The electrode part of the semiconductor element is electrically connected to the end part of an antenna circuit by a wire or a flip chip bonding. The surface of the antenna circuit is protected by a protective layer. <P>COPYRIGHT: (C)2003,JPO |
