| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor element mounting member in which a conductive layer in a through hole and the electrode layers of a main plane and an external connection surface are securely connected, imaging equipment, a member constituting a light-emitting diode, and the light-emitting diode formed by using the member constituting the light-emitting diode. <P>SOLUTION: In a semiconductor element mounting member BL, the inner surfaces of a through hole 11 are made to be taper surfaces 11b and 11c which are reduced in size from the main plane 21 side and an external connection surface 22 side to a minimum hole portion 11a. Angles θ<SB>1</SB>and θ<SB>2</SB>made by both the taper surfaces 11b and 11c, the main plane 21, and the external connection surface 22 are set to be blunt angles. The imaging equipment PE2 allows an imaging element PE1 to be mounted on a region surrounded by the frame body 4 of an insulating member 2. It is closed with a lid body FL. A member constituting a light-emitting diode LE2 allows a light-emitting element LE1 to be mounted on an insulating member 2 in which the minimum hole portion 11a is filled with a conductive material 33a. The light-emitting diode LE3 allows the member constituting the light-emitting diode LE2 to be mounted on a package 7. <P>COPYRIGHT: (C)2007,JPO&INPIT |
