DUAL-MOLDED MULTI-CHIP PACKAGE SYSTEM

摘要

PROBLEM TO BE SOLVED: To provide a dual-molded multi-chip package system (2500).

SOLUTION: A method for manufacturing a dual-molded multi-chip package system comprises a step of forming an embedded integrated circuit package system (200), having a first integrated circuit chip (102) and a first sealant covering a lead (110) connected to the first integrated circuit chip;a step of mounting a semiconductor device (216) on the first sealant (112) by connecting the lead; and a step of forming a second sealant (220) on the semiconductor device (216) and the embedded integrated circuit package system (202).

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