| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in adhesion to a substrate when formed into a film and capable of forming a fine resin pattern having a large film thickness and a high aspect ratio, and a pattern forming method using the same. <P>SOLUTION: The photosensitive resin composition contains diphenylsulfone or its derivative as an adhesion enhancer. The diphenylsulfone derivative is preferably prepared by substituting one or more hydrogen atoms of diphenylsulfone by amino groups, nitro groups, hydroxyl groups, carboxyl groups, fluorine atoms, chlorine atoms or acid anhydrides. In particular, the diphenylsulfone derivative is preferably prepared by substituting 3,3'- and/or 4,4'-position hydrogen atoms of diphenylsulfone by amino groups, nitro groups, hydroxyl groups, carboxyl groups, fluorine atoms, chlorine atoms or acid anhydrides. <P>COPYRIGHT: (C)2009,JPO&INPIT |
