TAPE FOR WAFER PROCESSING

摘要

PROBLEM TO BE SOLVED: To provide a tape for wafer processing capable of reducing occurrence of a label trace and entangling of air between an adhesive layer and an adhesive film.SOLUTION: A tape for wafer processing comprises: a long mold releasing film 11; an adhesive layer 12 having a prescribed planar shape and provided on a first surface of the mold releasing film 11; an adhesive film 13 covering the adhesive layer 12 and including a label part 13a having the prescribed planar shape and provided so as to come into contact with the mold releasing film 11 around the adhesive layer 12 and a peripheral part 13b provided so as to surround the outside of the label part 13a; and a support member 14 provided at one of both ends in a short direction of the mold releasing film 11 and in the region corresponding to the first surface region overlapping the label part 13a region in contact with the mold releasing film 11 on a second surface opposite to the first surface of the mold releasing film 11.SELECTED DRAWING: Figure 1