| 摘要 |
An outline forming method for a semiconductor device, including the steps of placing a film carrier on which a semiconductor chip is mounted in a molding die so as to enclose the semiconductor chip in a cavity defined in the molding die; clamping the film carrier with a clamp of the molding die; injecting a resin to be molded into the cavity; and shearing the film carrier by means of the clamp to separate the film carrier into a part present inside the cavity and a remaining part present outside the cavity. Also disclosed is a semiconductor manufacturing device comprising an upper die; a lower die adapted to be joined to the upper die through a film carrier on which an semiconductor chip is mounted; one of the upper die and the lower die being formed with a cavity recess; a clamp formed around the cavity recess by extending an inner wall of the cavity recess, for clamping a peripheral portion of the film carrier; the other of the upper die and the lower die being formed with a groove for receiving the clamp; and a cutting portion formed at a front end of the clamp for shearing the film carrier along an inner surface of the cavity recess. Accordingly, the sheared end surface of the film carrier is not projected from the outer surface of a molded resin. |
