SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which can increase spaces among a plurality of semiconductor chips without deterioration in handleability of the semiconductor chip.SOLUTION: A semiconductor device manufacturing method comprises: a process of singulating a wafer attached to a first adhesive sheet by dicing to form a plurality of semiconductor chips CP; a process of transferring the plurality of semiconductor chips CP to a second adhesive sheet 20 having an adhesive layer 22 which contains energy-ray curable adhesive; a process of detaching the first adhesive sheet; a process of irradiating energy rays to the second adhesive sheet 20 to cure the adhesive layer 22 in a region where the plurality of semiconductor chips are not attached; and a process of stretching the second adhesive sheet 20 to fracture the cured region of the adhesive layer 22 and increase spaces among the plurality of semiconductor chips CP.SELECTED DRAWING: Figure 3