| 摘要 |
<p>Disclosed herein are non-pressure sensitive, heat sealable adhesive compositions having high bonding strengths at temperatures below 75 DEG C which consist essentially of a mixture of a block copolymer of a vinylbenzene and a conjugated diolefin, and a copolymer of an alkene and vinyl acetate. These adhesives are useful in a variety of radiation sensitive materials, but particularly in photographic materials such as photographic film units. In such units, they are particularly useful to bond barrier timing layers to other layers or substrates, but also may be used to bond other layers or substrates.</p> |
