| 摘要 |
PURPOSE:To prevent the increase of electric resistance without damaging heat dissipation property, and to obtain a hybrid IC, the number of parts thereof is few, by mounting a metallic plate in Mo, Ta, etc. onto a metallic supporting plate through an insulator and fixing a semiconductor element onto the metallic plate by a conductive metal. CONSTITUTION:An insulating ceramics board having excellent thermal conductivity, which is made of Al2O3, SiC, etc., or an Si resin film 13 is placed onto a supporting plate 12 made of Cu, a Cu-C fiber composite material or the like. Ni etc. are plated onto the plate 11 of Mo or Ta, and these plates 12, 11 and film 13 are bonded 14, 15 by using Pb-Sn group solder or epoxy group resin. According to this constitution, since the thermal expansion coefficient of Mo or Ta 11 is close to that of the ceramics board, a thermal fatigue can be prevented, thermal strain is absorbed by resin itself regarding the difference of the thermal expansion coefficient with the insulator 13, and the fatigue is obviated. Mo or Ta functions as a main current path, and the increase of the resistance components of the Si elements 6 loaded is avoided. The thermal expansion coefficients of the Si elements 6 and Mo or Ta are close, the thermal fatigue is not generated, a conventional spacer can be omitted, and man-hours for assembly are reduced. |
