| 摘要 |
PURPOSE:To unnecessitate an insulation adhesive by isolating external leads from a heat dissipator in mechanical and electrical manner by a method wherein an electronic component assembled structure with an element body adhesion-fixed in a recess from working part of a lead frame and the heat dissipator joined to the back surface of the part is formed with a mold resin into an integral body. CONSTITUTION:Using the one having an element adhesion part 8 worked into a recess from as the lead frame 1, the back surface of the element adhesion part 8 is adhered on the heat dissipating block 2 by means of a solder 9 of a lower melting point than that of a solder 5, after the element 4 is adhesion-fixed on the bottom surface of the element adhesion part 8 by means of the solder 5. Next, the electronic component assembled structure is obtained by electrically connecting the electrode of the element 4 to the external lead by means of metallic fine wires 6, which is then molded by sealing with the mold resin 7 into an integral body. Thereby, the adhesion surface of the lead frame for the heat dissipating block 2 projects downward; therefore there is no possibility that the other part of the lead frame contacts the heat dissipating block 2, and then it becomes unnecessary to adhere the heat dissipating block to the lead frame with an electric insulation adhesive. |
