| 摘要 |
The specification describes a magnetic bubble device which incorporates a Z coil for providing a test magnetic field in addition to the usually provided bias field. In order to reduce package size the Z coil comprises at least one printed coil 17 formed on a substrate 15. The substrate 15 may be a flexible substrate such as polyimide film which is provided as a flap on a chip connection substrate formed from the same film, the flap folding over to lie parallel with the chip connection substrate. The invention enables a Z coil to be provided within a package without unduly increasing package height and provides an additional advantage that the substrate which supports the Z coil may be used to protect the magnetic bubble device chip.
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