发明名称 Spark gap assembly for hermetically packaged integrated circuits
摘要 Polysilicon is used as the spark gap material so that heat dissipation problems are greatly reduced. The spark gap assembly (10'') comprises (i) a first conductive electrode (18), (ii) a second conductive electrode (20) spaced from the first electrode, (iii) a first conductive layer (26) overlying the first electrode and a second conductive layer (24) overlying the second electrode, (iv) a spark gap (16) formed between the first and second conductive layers, and (v) discrete resistors in electrical communication with each layer proximate the gap, the resistors absorbing energy and limiting the energy dissipated in a spark discharge in the gap. An Independent claim is included for a method of limiting the energy dissipated from a spark discharge in a spark gap assembly.
申请公布号 DE19906856(A1) 申请公布日期 1999.09.02
申请号 DE1999106856 申请日期 1999.02.18
申请人 MITEL CORPORATION 发明人 ORCHARD-WEBB, JONATHAN HARRY
分类号 H01L23/62;H01T4/08 主分类号 H01L23/62
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