发明名称 LEAD BONDING
摘要 PURPOSE:To make wide the area of a part being fixed by pressure and to make it possible to increase a bonding strength by a method wherein a lead bonding is executed in a constitution wherein a pressure is applied to a covering pad formed, the lower face of a lead is fixed by pressure to a pad and the upper face of the lead is fixed by pressure to the covering pad. CONSTITUTION:A deposition is performed and thereafter, the points of tools 20 and 21 are respectively fitted into the apertures 16a and 16b of a mask 16, the tools 20 and 21 are pressed downward by a force F2 to apply a prescribed pressure to covering pads 17 and 18 and after this, the mask 16 is removed to complete a bonding. When the pressure is applied, the pad 17 is crushed as a whole, the gap 22 between pad parts 17a and 17b is crushed and a lead is pressed to a pad 11a. Here, the press through the tool 20 is performed in a state that the mask 16 is applied on the pad 17, the spreads of the pad parts 17a and 17b to their circumferential directions are limited by the peripheral wall of the aperture 16a of the mask 16, the gap 22 is reliably crushed and furthermore, the force to press to the lower direction is effectively acted. Thereby, the improvement of a bonding strength can be contrived.
申请公布号 JPH01222455(A) 申请公布日期 1989.09.05
申请号 JP19880048406 申请日期 1988.03.01
申请人 FUJITSU LTD 发明人 MURAKAMI RIE;KASHIWABARA HIROTAKA
分类号 H01L21/603;H01L21/60 主分类号 H01L21/603
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