发明名称 Multi-layer thin film structure and parallel processing method for fabricating same
摘要 A method and apparatus for releasing a workpiece from a substrate including providing a substrate which is transparent to a predetermined wavelength of electromagnetic radiation; forming, on the substrate, a separation layer which degrades in response to the predetermined radiation; providing the workpiece on the separation layer; and directing the predetermined radiation at the separation layer through the transparent substrate so as to degrade the separation layer and to separate the workpiece from the substrate.
申请公布号 US5258236(A) 申请公布日期 1993.11.02
申请号 US19910695368 申请日期 1991.05.03
申请人 IBM CORPORATION 发明人 ARJAVALINGAM, GNANALINGAM;DEUTSCH, ALINA;DOANY, FUAD E.;FURMAN, BRUCE K.;HUNT, DONALD J.;NARAYAN, CHANDRASEKHAR;OPRYSKO, MODEST M.;PURUSHOTHAMAN, SAMPATH;RANIERI, VINCENT;RENICK, STEPHEN;SHAW, JANE M.;WILCZYNSKI, JANUSZ S.;WITMAN, DAVID F.
分类号 B23K26/00;B32B37/00;H01L21/68;H01L23/12;H01L23/15;H05K3/00;H05K3/46;(IPC1-7):B32B15/04;H01L29/12 主分类号 B23K26/00
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