| 摘要 |
PURPOSE:To hold a semiconductor wafer without using wax, adhesives, etc., by a method wherein a silicon elastic body layer provided in holes leading to minute holes with high plane precision is provided on the solid substrate surface having vacuum chucking piercing minute holes. CONSTITUTION:When a semiconductor wafer is chucked, the semiconductor wafer is mounted onto a silicon elastic body 6 and vacuum-chucked from the reverse side of a solid substrate 4. By this vacuum chucking, the semiconductor wafer is pushed to the silicon elastic body 6. Thereafter, even if the vacuum chucking is stopped, the semiconductor wafer is held on the solid substrate 4 through the silicon elastic body 6 by surface stickiness of the silicon elastic body 6. Thus, as the semiconductor wafer is held by the surface stickiness of the silicon elastic body 6, a chucking power to the solid substrate is powerful. Thus, the semiconductor wafer can readily be performed grind processing. |
