PRODUCTION OF CERAMIC ELECTRONIC CIRCUIT SUBSTRATE

摘要

PURPOSE: To inexpensively obtain a ceramic circuit substrate excellent in heat cycle resistance so as to enable mass-production by joining metal plates to both sides of ceramic substrate by a specific method. CONSTITUTION: A ceramic (e.g. AlN) substrate 2 is moved in a state brought into contact with metal (e.g. Al) melt 1 and the substrate 2 is wetted with the melt 1 and cooled to join the metal plate solidified from the melt 1 to the both side of the substrate 2 and the both sides of the metal plate is polished to homogenize the metal plate. Then, a photosensitive resin film is heated and pressed onto the surface of the metal plate and exposed to light through a photomask onto the film and the film is subjected to developing treatment to form a circuit pattern-shaped resist film and a heat-release plate-shaped resist film is formed on the rear of the metal plate. The desired metal circuit pattern is formed on the surface of the substrate and a metal heat-releasing plate is formed on the rear by etching solution and plating treatment is applied onto the resultant metal circuit pattern and the heat release plate.