| 摘要 |
<p>PURPOSE: To provide a construction of low-cost, uniform-shaped bumps placed at small intervals and a simplified process for obtaining said construction. CONSTITUTION: An adhesive resin pad 3 having conductivity and a thickness of severalμm to 10μm is provided by printing method, dispenser method or the like on an electrode pad 2 placed on an integrated circuit chip or on a substrate 1, a solder ball is fixed on this adhesive resin pad 3, and this solder ball is melted and turned into a solder bump 4. Where, if a resin having conductivity and photosensitivity is used as the adhesive resin pad 3, then the adhesive resin pad 3 may be formed by using photolithography method.</p> |
