| 摘要 |
PROBLEM TO BE SOLVED: To reduce the man-hours for mounting a semiconductor device, in which an anisotropic conductive film with the same area as that of the semiconductor device is provided without using an insulating resin for sealing the outside of the semiconductor device. SOLUTION: In a first step, a given face 61 of a semiconductor device 60 is joined by thermal pressure to an anisotropic conductive film 70 having an area a little larger than that of the face 61. In this way, the anisotropic conductive film 70 is bonded to the given face 61 of the semiconductor device 60. In a second step the other face 75 than the bonded face 61 in the semiconductor device 60 is bonded by thermocompression to the part mounting face 51 of the board. |
