| 摘要 |
<p>A semiconductor die useful within a flip-chip semiconductor package has a plurality of grooves formed in a non-active surface thereof to improve the bendability of the non-active surface with a heat sink. In one version, a flip-chip semiconductor package includes a package substrate having an upper surface, a lower surface and a plurality of conductive traces, the upper surface having an upper plurality of electrical contacts coupled to the conductive traces, the lower surface having a lower plurality of electrical contacts coupled to the conductive traces, the lower plurality of electrical contacts being attachable to electrical contacts on a printed circuit board. A semiconductor die having an active surface and a non-active surface is placed in the semiconductor package by attaching a plurality of bond pads formed on an active surface of the die with the upper plurality of electrical contacts of the package substrate by way of solder bumps. The non-active surface of the die has a plurality of grooves formed thereon. The grooves facilitate attachment of a heat sink to the non-active surface using a thermally-conductive adhesive, and make thermal transfer between the heat sink and die more efficient. <IMAGE></p> |
