| 摘要 |
PROBLEM TO BE SOLVED: To provide a bump grid array package and its manufacture method. SOLUTION: Multiple bumps 31 and a bridge which supports the bumps 31 are formed in a metal frame. Liquid solder is applied to the bumps 31, and the frame is matching-arranged on a semiconductor substrate, where patterns are formed such that the bumps 31 come to the positions of the patterns. The bumps 31 are soldered to the patterns 24b, and the connection parts of the bumps 31 and the bridge are broken so as to separate the bumps 31 from the frame. Thus, the multiple bumps 31 can be adhered to the patterns all at once by using the frame. Since not only the frame easily matches with the substrate but also the bumps 31 are adhered by soldering in a state where they are supported by the frame, a possibility of matching failure and separation of the bumps 31 are eliminated, a manufacturing process is simplified, and the reliability of a semiconductor package can be enhanced. |
