METHOD OF MAKING AN ADHESIVE PREFORM LID FOR ELECTRONIC DEVICES

摘要

An electronic device (22) is enclosed within a package or module (10) having a lid (40) that is sealed with an adhesive preform (30) that has been pre-applied onto the bonding areas of the lid (40). The adhesive preforms (30) are formed of a wet adhesive deposited on a release substrate (32) as a preform in predetermined locations with respect to a set of reference guide holes (34, 36) so as to facilitate subsequent attachment to lids (40) with pick-and-place equipment or a guide plate. The wet adhesive preforms (30) are B-staged or dried to form dry solid adhesive preforms (30). Both the lids (40) and the adhesive preforms (30) may be formed of electrically insulating or electrically conducting materials. In use, the lids (40) and adhesive preforms (30) are attached to enclose the electronic device (22) by bonding the adhesive preforms (30) at temperatures that are substantially lower than those at which the soldering of conventional lids is typically performed.