发明名称 Method for fabricating capacitor in integrated circuit
摘要 A method for fabricating a capacitor in an integrated circuit, using tantalum oxide as the dielectric layer to obtain a higher capacitance. A barrier layer is formed between the polysilicon layer and the tantalum oxide layer to prevent the formation of a silicon oxide layer. Thus, that capacitance of the capacitor is not reduced by the additional thickness of the silicon oxide layer.
申请公布号 US6156600(A) 申请公布日期 2000.12.05
申请号 US19980195173 申请日期 1998.11.17
申请人 UNITED MICROELECTRONICS CORP. 发明人 CHAO, FANG-CHING;HSIEH, WEN-YI;HUANG, KUO-TAI
分类号 H01L27/04;H01L21/02;H01L21/316;H01L21/822;H01L21/8242;H01L27/108;(IPC1-7):H01L21/823 主分类号 H01L27/04
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