| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing jig for a contact pin of a semiconductor IC test socket effectively removing the solder wastes stuck to the contact pin of the socket used in a final test for a correct judgment on the quality of a semiconductor IC to increase the reliability of the result of the final test, and easy to manufacture at a low cost. SOLUTION: This jig for polishing the contact pin of the socket used when conducting the final test of the semiconductor IC is provided with a terminal pin section 12 matched with the lead of the semiconductor IC. An abrasive grain face 13 for polishing the surface of the contact pin is formed on the portion of the terminal pin section 12 abutting on the contact pin by fixing cemented carbide grains 14 of diamond or the like by electrodeposition.
|
