| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor pressure sensor which can be used even in an environment where the sensor comes into contact with gasoline or the like. SOLUTION: A recess 3 is formed to a base 1 and a pair of through holes 2 are formed to be opposite to each other across the recess 3. A stage 10 is die-bonded to a bottom part of the recess 3 with a fluorine-based elastomer resin 12, a pressure-sensitive chip 11 is set on the upper face of the stage 10, and thereby, a pressure-sensitive chip part is constituted. A lead 14 is arranged on the upper face of the base 1. A frame body 4 is set on the lead 14, over which a sensor housing is fitted via a cap adhesive 17. The sensor housing is comprised of a base part 5 having a recess 8 formed to a lower face central part and a pressure introduction part 6 having a smaller diameter than a diameter of the base part 5. A port 7 is formed continuously with the recess 8 to a central part of the pressure introduction part 6. The pressure-sensitive chip 11 is connected by a gold wire 13 to the lead 14. A lead-sealing part 15 is formed to a joining part of the lead 14. The pressure-sensitive chip 11 is coated with a protecting resin layer 20.
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