Method for structuring wafers or substrates using UBM layer technology, involves adhering plastics strip to surface of wafer and punching holes using laser through plastic band, above UBM layer

摘要

Method for forming metal structures on a wafer, involves forming a substructure metal layer (UBM) (12) on an electrode terminal face (11) on the surface of a wafer (1). A plastic strip is adhered to the surface of the wafer (1) and holes are stamped through the plastic strip above the UBM using a laser, to form a blind-hole in the plastic strip above the UBM (12), followed by filling a solder paste (5) into the blind-hole with a slider. The solder paste is subsequently melted and cooled to form a solder block (6), and the plastic strip is removed to release the solder block (6), and then the solder block is melted to form a solder ball (7).