| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for fabricating a semiconductor device, a reticle and a semiconductor wafer in which a necessary and sufficient alignment mark can be provided without having any effect on the space factor of an integrated circuit chip for a pattern of single exposure shot. SOLUTION: Initial stage of a process for exposing a specified mask pattern such that a plurality of integrated circuit chip regions 12 are formed on a semiconductor wafer WF while being spaced apart by a scribe line region 13 is shown. When a well region is formed at first, for example, an alignment mark 14 for next exposure process is provided additionally in the integrated circuit chip region 12.</p> |
