发明名称 TAPE AUTOMATIC BONDING FOR PACKAGING CONNECTING BAND OF FLAT DISPLAY
摘要 PROBLEM TO BE SOLVED: To prevent a conduction layer of a tape automatic bonding from being broken by vibration. SOLUTION: In constitution of the tape automatic bonding for packaging a connection device of LCO display, a shape of a bent slit is designed so as to have larger width near two ends parts located at mutually opposite sides and further to have smaller width at a central region. Thereby a bent slit part of the conduction layer can be prevented from being broken by vibration.
申请公布号 JP2002156917(A) 申请公布日期 2002.05.31
申请号 JP20010210594 申请日期 2001.07.11
申请人 CHI MEI OPTOELECTRONICS CORP 发明人 HOWAN KUN-FEN;SHUU SHIN-FA
分类号 G02F1/1345;G02F1/13;G09F9/00;H05K1/00;(IPC1-7):G09F9/00;G02F1/134 主分类号 G02F1/1345
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