发明名称 |
TAPE AUTOMATIC BONDING FOR PACKAGING CONNECTING BAND OF FLAT DISPLAY |
摘要 |
PROBLEM TO BE SOLVED: To prevent a conduction layer of a tape automatic bonding from being broken by vibration. SOLUTION: In constitution of the tape automatic bonding for packaging a connection device of LCO display, a shape of a bent slit is designed so as to have larger width near two ends parts located at mutually opposite sides and further to have smaller width at a central region. Thereby a bent slit part of the conduction layer can be prevented from being broken by vibration. |
申请公布号 |
JP2002156917(A) |
申请公布日期 |
2002.05.31 |
申请号 |
JP20010210594 |
申请日期 |
2001.07.11 |
申请人 |
CHI MEI OPTOELECTRONICS CORP |
发明人 |
HOWAN KUN-FEN;SHUU SHIN-FA |
分类号 |
G02F1/1345;G02F1/13;G09F9/00;H05K1/00;(IPC1-7):G09F9/00;G02F1/134 |
主分类号 |
G02F1/1345 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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