| 摘要 |
The invention is directed towards improved structures for use with micro-machined ultrasonic transducers (MUTs), and methods for fabricating the improved structures. In one embodiment, a MUT on a substrate includes an acoustic cavity formed within the substrate at a location below the MUT. The cavity is filled with an acoustic attenuation material to absorb acoustic waves in the substrate, and to reduce parasitic capacitance. In another embodiment, the cavity is formed below a plurality of MUTs, and filled with an attenuation material. In still another embodiment, an attenuation material substantially encapsulates a plurality of MUTs on a dielectric layer. In yet other embodiments, at least one monolithic semiconductor circuit is formed in the substrate that may be operatively coupled to the MUTs to perform signal processing and/or control operations. |
