| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat-dissipating member in which a flexibility and restoring properties are further improved while maintaining a high-heat conductivity. SOLUTION: The heat-dissipating member is characterised by being formed by molding and curing the mixture of the ground substance of a silicone-resin cured substance containing heat-conductive fillers and an uncured silicone resin containing the fillers or containing no filler. And also, the heat-dissipating member is characterised by being formed by molding and curing the mixture of the ground substance of the silicone-resin cured substance containing no heat-conductive filler and the uncured silicone resin containing the heat-conductive fillers. COPYRIGHT: (C)2005,JPO&NCIPI
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