| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer assembly capable of mounting numerous liquid metal microswitches. SOLUTION: The electric type switching multi-layered assembly is provided with a liquid metal channel (112) heater cavities and lower-part and upper-part switching device layers (53, 54) equipped with their connection flow passages. The respective switching device layers are provided with first and second non-conductive substrates (56, 58; 57, 59), patterned first and second dielectric material layers (79, 113; 80, 115), and adhesive layers (78, 114). For example, the both switching device layers connect respective inner conductor passages (85) to the external conductive pads (70) at conductive viaholes (75), and furthermore, are connected to pads (65) in the more external environment (52) than that of soldering balls (60). COPYRIGHT: (C)2005,JPO&NCIPI
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