| 摘要 |
The layer structure of a blanking die produced according to a CVD method contains a thick outer covering layer of TM-TiCN, and a multilayer Al2O3 layer arranged beneath the covering layer. Said multilayer Al2O3 layer consists of at least two aluminium oxide layers between which TiCN layers, and optionally TiAlC-NO layers for improving adhesion, are arranged. One such overall design has especially good chip removal properties.
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