| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To maximally prevent deformation of a wiring substrate due to warpage of a heat sink generated with resin burrs, caused by pressure during molding, as fulcrums in a mold package in which the wiring substrate is mounted onto one face of the plate-like heat sink so as to seal it with a mold resin and the other face of the heat sink is exposed from the mold resin. <P>SOLUTION: A convex surface 11a having a convex surface protruded toward the wiring substrate 20 side is provided at a part on one face 11 of the heat sink 10 where the wiring substrate 20 is mounted. The wiring substrate 20 is joined onto the convex surface 11a via an adhesive 40. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
