发明名称 CUTTING APPARATUS
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a cutting apparatus capable of suppressing deposition of scraps generated from a workpiece to be cut by laser beams on both sides of the workpiece or a laser beam emitting surface. <P>SOLUTION: The cutting apparatus 100 cuts the workpiece 120 arranged in a workpiece installation area 165 with laser beams. The cutting apparatus has a laser oscillator 110 for emitting laser beams, and a cover member 190 for surrounding a laser beam irradiation space S between the laser beam emitting surface 110a for emitting laser beams in the laser oscillator and the workpiece installation area. The cover member has a first air inlet 191 for taking in first air A1 and an air outlet 192 for discharging the first air. A flow passage of the second air A2 is formed on the side opposite to the laser beam irradiation space with respect to the workpiece installation area. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008023548(A) 申请公布日期 2008.02.07
申请号 JP20060197473 申请日期 2006.07.19
申请人 APIC YAMADA CORP 发明人 ANDO SHUJI;UCHIYAMA SHIGEYUKI;OGUCHI TATSUJI
分类号 B23K26/38;B23K26/12;B23K26/14;B23K26/40;B23K101/42 主分类号 B23K26/38
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