| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing device and a polishing method capable of preventing sag from being generated on a polished surface on the boundary part on the outer peripheral side of a semiconductor wafer to make the surface completely flat. SOLUTION: In a polishing device in which a material 24 to be polished is pressed against a polishing cloth 23 arranged opposite to the surface to be polished, and then polished, a holding means 33 for holding the material 24 to be polished with its surface to be polished being exposed, a first driving means 37 for pressing the holding means 33 against the polishing cloth 23 while freely adjusting its pressing force and rotationally driving the holding means, a guide ring body 43 provided outside the holding means 33 independently of the rotational driving of the holding means 33 to be in contact with the polishing cloth 23 at its lower end, and second driving means 46, 50 for pressing the guide ring body 43 against the polishing cloth 23 while their pressing force is adapted to be adjustable, and rotationally driving the guide ring body 43 independently of the holding means 33, are provided. |
