发明名称 POLISHING DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To prevent the leakage of storage information in discarding a consumable article such as a polishing pad in a polishing device which manages the storage information by attaching an RF tag to the consumable article. <P>SOLUTION: A wafer polishing device 10 for carrying out the CMP polishing of a wafer W is provided with a polishing pad 15 to be used in the wafer polishing device; a polishing head 12 on which the polishing pad 15 is mounted so as to be freely attachable/detachable through a support plate 13; an RF tag 421 formed in the support plate 13 for supporting the polishing pad 15; a reader/writer 423 formed in the polishing head 12 for reading/writing and erasing the information in a non-contact state for the RF tag 421; and a control device 400 for reading/writing predetermined information for the RF tag 421 by the reader/writer 423 while the polishing pad 15 is mounted on the polishing head 12, and for erasing data written in the RF tag 421 when the polishing pad 15 is detached from the polishing header 12. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2008310404(A) 申请公布日期 2008.12.25
申请号 JP20070155011 申请日期 2007.06.12
申请人 NIKON CORP 发明人 TANAKA TOSHIHISA;TANAKA JUNJI;UEDA TAKEHIKO;KOBAYASHI HITOSHI
分类号 G05B19/418;B24B37/00;B24B53/00;B24B55/00;H01L21/02;H01L21/304 主分类号 G05B19/418
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