发明名称 CUTTING APPARATUS
摘要 This invention provides a cutting apparatus which can prevent the occurrence of cracks and can cut an object cutting material accurately and stably without sacrificing the quality of the object cutting material. The cutting apparatus is a cutting apparatus (10) for cutting an object cutting material (W) formed of a fragile material such as glass, ceramic, or a semiconductor material and comprises a cutting tool (12) disposed abuttably against a desired cutting site (i) in the object cutting material (W), and displacement means for causing relative movement between the cutting tool (12) and the object cutting material (W) along the cutting site (i). The cutting tool (12) comprises a cutting edge part (18) provided with an edge part (20) for cutting the object cutting material (W) and a heating element for heating the cutting edge part (18) at a temperature at or above the softening point of the object cutting material (W). The cutting site (i) in the object cutting material (W) is machined for cutting by causing relative movement between the object cutting material (W) and the edge part (20) heated by the heating element by the displacement means.
申请公布号 KR20090023678(A) 申请公布日期 2009.03.05
申请号 KR20097000370 申请日期 2007.07.13
申请人 TAKITA RESEARCH & DEVELOPMENT CO., LTD. 发明人 TAKITA MASAAKI
分类号 B28D5/04;C03B33/023;C03B33/10 主分类号 B28D5/04
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