| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component and the manufacturing method thereof, which is able to achieve the low cost with the simple manufacturing process, without requiring special manufacturing conditions. SOLUTION: This electronic component has the characteristics, in which the first metal layer including copper and the second metal layer, including the noble metal other than the copper are provided and the oxide layer including nickel oxide and/or tin oxide, are formed between the first and second metal layer. The electronic component is formed by the following ways. The paste for the first metal layer is applied on a base material. Sintering is performed in neutral or reducing atmosphere, and the first metal layer is formed. A nickel layer and/or a tin layer are formed on the first metal layer through plating. Furthermore, the paste for the second metal layer is applied on the layer. By sintering the paste in the oxidizing atmosphere, the second metal layer is formed. At the same time, the nickel layer and/of the tin layer are oxidized, and the oxide layer is formed. |
