| 发明名称 |
METHOD OF MANUFACTURING SUBSTRATE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE |
| 摘要 |
There is provided a method of manufacturing a substrate, the method including: polishing a surface of a material substrate; and forming a penalization film on the surface of the material substrate alter the polishing of the surface of the material substrate. |
| 申请公布号 |
US2016165735(A1) |
申请公布日期 |
2016.06.09 |
| 申请号 |
US201414905115 |
申请日期 |
2014.06.24 |
| 申请人 |
SONY CORPORATION |
发明人 |
AKASAKA Shin;KUMON Satoshi;SATOU Kentarou;OISHI Yuki |
| 分类号 |
H05K3/26 |
主分类号 |
H05K3/26 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of manufacturing a substrate, the method comprising;
polishing a surface of a material substrate; and forming a planarization film on the surface of the material substrate after the polishing of the surface of the material substrate. |
| 地址 |
Minato-ku, Tokyo JP |
