THREE-DIMENSIONAL PASSIVE COMPONENTS

摘要

Three-dimensional inductors may comprise a passivation layer disposed on a substrate, a three-dimensional pillar comprising a ferromagnetic material disposed on the substrate or the passivation layer, and a conductive trace wound at least partially around the pillar. Three-dimensional capacitors may comprise a passivation layer disposed on a substrate, at least two support pillars comprising a polymeric material disposed on the passivation layer or the substrate, at least two electrodes disposed between the support pillars, a dielectric disposed between the electrodes, and a metal trace. Methods of manufacturing the three-dimensional passives, such as inductors and capacitors, may comprise direct writing the components and curing them for on-chip applications.

主权项

1. A device comprising:
a substrate; a pillar disposed on at least a portion of the substrate layer, the pillar comprising a ferromagnetic material or a polymer, the pillar defining a three-dimensional structure projecting out from the substrate; and a conductive trace wound at least partially around the pillar.