| 摘要 |
The present invention addresses the problem of providing: a thermosetting resin composition that provides a cured object which has low permittivity and a low dielectric dissipation factor, while having excellent flame retardancy, heat resistance, and pyrolysis resistance; a cured object obtained from the composition; and an active ester resin for use in the composition. Specifically, the abovementioned problem is solved by providing a thermosetting resin composition characterized by comprising, as essential components, an epoxy resin and an active ester resin characterized by having a resin structure which has a structural portion represented by formula (I) and in which each of both terminals is a monovalent aryloxy group. |
