PACKAGE FOR MOUNTING ELECTRONIC COMPONENT AND ELECTRONIC DEVICE

摘要

Provided are: a package for mounting an electronic component with which it is possible to make heat distribution in a curved electronic component mounting section uniform; and an electronic device. A package 1 for mounting an electronic component comprises: a first principal surface and a second principal surface; a substrate 2 which is provided in the first principal surface and which comprises a concave section 2d or a convex section 2e that is arc-shaped in a vertical cross-sectional view; and a curved electronic component mounting section 11 which is provided in the concave section 2d or the convex section 2e and on which a bowed curved electronic component 10 is mounted. The substrate 2, when viewed in a plan perspective view from the side of the first principal surface, comprises a cutaway 4 in the second principal surface so as to overlap the curved electronic component mounting section 11.