发明名称 SUBSTRATE PROCESSING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing device which hardly damages a brittle material substrate.SOLUTION: A substrate processing device comprises: a belt 11 for conveying a brittle material substrate 300; a clamp device 40 for clamping the brittle material substrate 300 placed on the belt 11; a common drive device 20 for moving the belt 11 and the clamp device 40 in a conveying direction of the brittle material substrate 300; and a pre-process device 100 for placing the brittle material substrate 300 on the belt 11 from above the belt 11. The clamp device comprises: a substrate support part for supporting the brittle material substrate 300 from below while a position corresponding to the belt 11 is fixed; and an arm which rotates or moves with respect to the substrate support part, and sandwiches the brittle material substrate 300 between itself and the substrate support part.SELECTED DRAWING: Figure 1
申请公布号 JP2016137717(A) 申请公布日期 2016.08.04
申请号 JP20160027550 申请日期 2016.02.17
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO LTD 发明人 TOKUNAGA NAO
分类号 B28D7/00;B28D7/04;C03B33/03 主分类号 B28D7/00
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