METHOD FOR MANUFACTURING A MULTI-LAYER FPCB OF FINE ALIGNED

摘要

The present invention relates to a multi-layer flexible circuit board for fine alignment suitable for high-concentration circuit formation. More specifically, the multi-layer flexible circuit board can prevent defects and reduce manufacturing costs by reducing the number of steps in a process compared to the case in a conventional multi-layer flexible printed circuit board (FPCB) manufacturing process. The multi-layer flexible circuit board can reduce material costs by reducing the number of dry films being used in a conventional multi-layer circuit process. The multi-layer flexible circuit board also can optimize the multi-layer and high-concentration flexible circuit board manufacturing by solving the misalignment of individual layers, which occurs more frequently in a high-concentration circuit board due to a difference in subtraction and expansion rates of the individual layers by using novel process technology methods. The novel process technology methods can include a technology of matching a window hole of a layer to be laminated and an align mark formed on a previous layer while laminating layers sequentially, a cost reduction technology of forming a circuit in advance on an inner layer in a sequential lamination process and using a carrier film on an outer layer instead of a conventional dry film to laminate the layers, and a technology of measuring the subtraction rate of the window hole and align mark of different layers in advance and correcting the subtraction rate to be applied in the sequential lamination process.