INTERPOSER AND ELECTRONIC COMPONENT

摘要

The present application provides an interposer, including an interposer substrate, at least one through silicon via, a first shield layer, a first insulation layer, a first cable layout layer, and at least one first bump. The interposer substrate includes an upper surface and a lower surface; the at least one through silicon via is buried in the interposer substrate and runs through the upper surface and the lower surface; the first shield layer is disposed on the upper surface of the interposer substrate and the first shield layer has electrical conductivity; the first insulation layer is disposed at the first shield layer; the first cable layout layer is disposed at the first insulation layer and is electrically connected to the at least one through silicon via.

主权项

1. A interposer, comprising:
a interposer substrate with an upper surface and a lower surface; at least one through silicon via, buried in the interposer substrate, that runs through the upper surface and the lower surface of the interposer substrate; a first shield layer disposed on the upper surface of the interposer substrate wherein the first shield layer is electrically conductive; a first insulation layer disposed at the first shield layer; a first cable layout layer disposed at the first insulation layer, the first cable layout layer electrically connected to one or more through silicon vias of the at least one through silicon via; and at least one first bump disposed at the first cable layout layer, the at least one first bump electrically connected to the at least one through silicon via by using the first cable layout layer.