| 摘要 |
PROBLEM TO BE SOLVED: To form a dielectric layer having high dielectric strength and excellent in transparency by impasting a thermoplastic resin contg. a specified glass powder. SOLUTION: The dielectric forming material is obtd. by kneading 30-90 wt.% glass powder consisting of, by weight, 50-70% PbO, 2-30% B2 O2 , 2-35% SiO2 and 0-20% ZnO+CaO, exhibiting good flowability by heating at 500-600 deg.C and having <=10 μm max. particle diameter Dmax and <=2 μm 50% particle diameter with 0.1-30 wt.% thermoplastic resin such as polybutyl methacrylate, polyvinyl butyral, polymethyl methacrylate or polyethyl methacrylate, 0-50 wt.% plasticizer such as butylbenzyl phthalate or dioctyl phthalate and 5-60 wt.% solvent such as terpineol or diethylene glycol monobutyl ether. Powder of alumina, zirconia or the like may be added by up to 10 wt.% so as to adjust the flowability of the obtd. paste and the coefft. of thermal expansion. |
